Lenovo High Density Server

Sever Brand: Lenovo

Server Product: ThinkSystem SD650N V2 High Density Server

Form Factor/Height: 6U rack-mount with 6 trays

Processor Structure: 2x 3rd Gen Intel Xeon Scalable processors per node

Memory: Up to 2.0TB using 16x 128GB 3200MHz TruDDR4 RDIMMs per tray

Storage: 2x 2.5-inch slim SATA / NVMe U.2 SSD and 2x M.2 SATA SSD SW RAID and Intel VROC for Intel drives only

NIC: 1x SFP28 25Gb LOM, NCSI 1x RJ45 1GbE, NCSI

PCIe: 2x x16 PCIe Gen4 LP per tray

Power Supply: 6/9 N+1 redundant hot-swap PSUs (up to 2400W Platinum)

Cooling System: Direct Water Cooling with up to 50C inlet water temperature

Management: Lenovo XClarity Controller (XCC) and Lenovo Intelligent Computing Orchestration (LiCO)

OS Support: Red Hat Enterprise Linux, SUSE Linux Enterprise Server Tested on CentOS

Acceleration: NVIDIA HGX A100 4-GPU with 4x NVLink connected SXM4 GPUs

Warranty: 3 year CRU & Onsite 9x5 Next Business Day (NBD)

Sever Brand: Lenovo

Server Product: ThinkSystem SD650 V3 High-Density Server

Form Factor: Full-wide 1U tray (two SD650 V3 nodes per tray, six per DW612S Enclosure)

Chassis: DW612S Enclosure (6U)

Processors Structure: Two 4th Gen Intel Xeon Scalable processors per node, or 2x 4th Gen Intel Xeon CPU Max series processors with HBM per node; 2x nodes per 1U tray

RAM : Up to 2.0TB using 16x 128GB 4800 MHz per node

I/O Expansion: Up to 2x PCIe Gen5 x16 low-profile adapter slots (2x supported without internal storage) per node for NDR InfiniBand. Shared I/O and SocketDirect supported.

Internal Storage: Up to 4x 2.5 SATA/NVMe SSDs (7mm height) or 2x 2.5 NVMe SSDs (15mm height) per node; up to 1x liquid cooled M.2 NVMe SSD for both operating system boot and storage functions

RAID Support: Onboard SATA controller with SW RAID or Intel VROC

Network Interface: Two onboard Ethernet interfaces: 2x 25GbE SFP28 LOM (1Gb, 10Gb or 25Gb capable; supports NC-SI) and 1x 1GbE RJ45 (supports NC-SI)

Power Management: Rack-level power capping and management via open-source management software Confluent and application-level energy optimization through Energy Aware Runtime (EAR)

Systems Management: Systems management using Lenovo HPC&AI Software stack with Lenovo Intelligent Computing Orchestration (LiCO) portal and XClarity Controller (XCC). Supports TPM 2.0 for advanced cryptographic functionality. SMM management module in the enclosure, supports daisy chaining to reduce cabling requirements

Front access: All adapters and drives are accessible from the front of the server. Front ports include KVM breakout connector and External Diagnostics Handset port for local management.

Rear access: 2x RJ45 on the SMM management module in the enclosure for XCC with daisy chain support; USB 2.0 for SMM FFDC log collection

Power Supply: Up to 9x air CFF v4 (2400W PT, 2600W TT) ; Up to 3x Direct Water Cooled Power Supply (7200W) 80+ Titanium; N+1 redundancy (only air-cooled / without acceleration on DWC)

Cooling Design: Direct Water Cooling at the heat source with up to 45C inlet water temperature

OS Support: Red Hat, SUSE, Rocky Linux (with LeSI support); Visit  lenovopress.com/osig for more information.

Warranty: 3 year CRU & Onsite 9x5 Next Business Day (NBD)

Sever Brand: Lenovo

Server Product: ThinkSystem SD650I V3 High Density Server

Form Factor/Height: 6U rack-mount with 6 trays

Processor Structure: 2x 4th Gen Intel Xeon Scalable processors per tray or 2x Intel Xeon CPU Max processors per tray

Ram: Up to 2.0TB using 16x 128GB 4800 MHz TruDDR5 RDIMMs per tray

Storage: Up to 4x 7mm or 2x 15mm U.2/SATA, no drive/backplane choice and 1 x liquid cooled M.2 NVMe SSD, providing both the boot drive and storage function SW RAID and Intel VROC for Intel drives only

NIC: 2 x SFP28 25Gb LOM, NCSI (10Gb capable); 1x RJ45 1GbE, NCSI

PCIe: 2x x16 PCIe Gen5 LP per tray

Power Supply: Up to 9x air CFF v4 (2400W PT, 2600W TT); Up to 3x Direct Water Cooled Power Supply (7200W) 80+ Titanium

Cooling System: Direct Water Cooling with up to 50C inlet water temperature

Management: Lenovo XClarity Controller (XCC) and Lenovo Intelligent Computing Orchestration (LiCO)

OS Support: Red Hat Enterprise Linux, SUSE Linux Enterprise Server

Acceleration: Four Intel Data Center GPU Max <=600W TDP

Warranty: 3 year CRU & Onsite 9x5 Next Business Day (NBD)

Sever Brand: Lenovo

Server Product: ThinkSystem SD665 V3 Server

Form Factor: Full-wide 1U tray; 2 nodes per tray

Chassis: DW612S Enclosure (6U)

Processors Structure: 2x 4th Generation AMD EPYC Processors per node

RAM: Up to 3.0TB using 24x 128GB 4800 MHz TruDDR5 RDIMM slots per tray

I/O Expansion: Up to 2x PCIe Gen5 x16 low-profile adapter slots (2x supported without internal storage) per node for NDR InfiniBand. Shared I/O and SocketDirect supported.

Internal Storage: Up to 4x 2.5-inch NVMe SSDs (7mm height) or 2x 2.5-inch NVMe SSDs (15mm height) per node; up to 1x liquid cooled M.2 NVMe SSD for both operating system boot and storage functions

RAID Support: OS Software RAID

Network Interfaces: Two onboard Ethernet interfaces: 2x 25GbE SFP28 LOM (1Gb, 10Gb or 25Gb capable; supports NC-SI) and 1x 1GbE RJ45 (supports NC-SI)

Power Management: Rack-level power capping and management via open-source management software Confluent and application-level energy optimization through Energy Aware Runtime (EAR)

Systems Management: Systems management using Lenovo HPC&AI Software stack with Lenovo Intelligent Computing Orchestration (LiCO) portal and XClarity Controller (XCC). Supports TPM 2.0 for advanced cryptographic functionality. SMM management module in the enclosure, supports daisy chaining to reduce cabling requirements

Front Access: All adapters and drives are accessible from the front of the server. Front ports include KVM breakout connector and External Diagnostics Handset port for local management.

Rear Access: 2x RJ45 on the SMM management module in the enclosure for XCC with daisy chain support; USB 2.0 for SMM FFDC log collection

Power Supply: Up to 9x hot-swap air-cooled power supplies (2400W Platinum, 2600W Titanium), or Up to 3x hot-swap direct-water-cooled power supplies (7200W Titanium)Supports up to N+1 redundancy

Cooling Design: Direct Water Cooling at the heat source with up to 50C inlet water temperature

OS Support: Red Hat, SUSE, Rocky Linux (with LeSI support); Visit lenovopress.com/osig for more information.

Warranty: 3 year CRU & Onsite 9x5 Next Business Day (NBD)

Sever Brand: Lenovo

Server Product: ThinkSystem SD650N V3 Server

Form Factor: Full-wide 1U tray; 1 node+GPUs per tray

Chassis: DW612S Enclosure (6U)

Processor Structure: Two 5th Gen Intel Xeon Scalable processors per tray, or 2x Intel Xeon CPU Max Series processors per tray

RAM: Up to 2TB using 16x 128GB 5600MHz TruDDR5 RDIMM slots per tray

I/O Expansion: NVIDIA ConnectX-7 4-chip VPI PCIe Gen5 Mezz Board for GPUdirect I/O

Acceleration: NVIDIA HGX H100 4-GPU with 4x NVLink connected SXM5 GPUs

Storage: Up to 2x 2.5 NVMe SSDs (7mm height) or 1x 2.5 NVMe SSDs (15mm height) per node, Up to 1x liquid cooled M.2 NVMe SSD for both operating system boot and storage functions

RAID Support: OS Software RAID

Network Interfaces: Two onboard Ethernet interfaces: 2x 25GbE SFP28 LOM (1Gb, 10Gb or 25Gb capable; supports NC-SI) and 1x 1GbE RJ45 (supports NC-SI)

Power Management: Rack-level power capping and management via open-source management software Confluent and application-level energy optimization through Energy Aware Runtime (EAR)

Systems Management: Systems management using Lenovo HPC&AI Software stack with Lenovo Intelligent Computing Orchestration (LiCO) portal and XClarity Controller (XCC). Supports TPM 2.0 for advanced cryptographic functionality. SMM management module in the enclosure, supports daisy chaining to reduce cabling requirements

Front Access: All adapters and drives are accessible from the front of the server. Front ports include KVM breakout connector and External Diagnostics Handset port for local management.

Rear Access: 2x RJ45 on the SMM management module in the enclosure for XCC with daisy chain support; USB 2.0 for SMM FFDC log collection

Power Supply: Up to 9x hot-swap air-cooled power supplies (2400W Platinum, 2600W Titanium), or Up to 3x hot-swap direct-water-cooled power supplies (7200W Titanium) Supports up to N+1 redundancy

Cooling Design: Direct Water Cooling at the heat source with up to 45C inlet water temperature

OS Support: Red Hat, SUSE, Rocky Linux (with LeSI support); Visit: lenovopress.com/osig for more information.

Warranty: 3 year CRU & Onsite 9x5 Next Business Day (NBD)

Sever Brand: Lenovo

Server Product: ThinkSystem SD665N V3 Server

Form Factor: Full-wide 1U tray; 1 node+GPUs per tray

Chassis: DW612S Enclosure (6U)

Processor Structure: 1x or 2x 4th Generation AMD EPYC Processors per node

RAM : Up to 3.0TB using 24x 128GB 4800 MHz TruDDR5 RDIMM slots per tray

I/O Expansion: NVIDIA ConnectX-7 4-chip VPI PCIe Gen5 Mezz Board for GPUdirect I/O

Acceleration: NVIDIA HGX H100 4-GPU with 4x NVLink connected SXM5 GPUs

Storage: Up to 2x 2.5 NVMe SSDs (7mm height) or 1x 2.5 NVMe SSDs (15mm height) per node, Up to 1x liquid cooled M.2 NVMe SSD for both operating system boot and storage functions

RAID Support: OS Software RAID

Network Interfaces: Two onboard Ethernet interfaces: 2x 25GbE SFP28 LOM (1Gb, 10Gb or 25Gb capable; supports NC-SI) and 1x 1GbE RJ45 (supports NC-SI)

Power Management: Rack-level power capping and management via open-source management software Confluent and application-level energy optimization through Energy Aware Runtime (EAR)

Systems Management: Systems management using Lenovo HPC&AI Software stack with Lenovo Intelligent Computing Orchestration (LiCO) portal and XClarity Controller (XCC). Supports TPM 2.0 for advanced cryptographic functionality. SMM management module in the enclosure, supports daisy chaining to reduce cabling requirements

Front access: All adapters and drives are accessible from the front of the server. Front ports include KVM breakout connector and External Diagnostics Handset port for local management.

Rear access: 2x RJ45 on the SMM management module in the enclosure for XCC with daisy chain support; USB 2.0 for SMM FFDC log collection

Power Supply: Up to 9x hot-swap air-cooled power supplies (2400W Platinum, 2600W Titanium), or Up to 3x hot-swap direct-water-cooled power supplies (7200W Titanium) Supports up to N+1 redundancy

Cooling Design: Direct Water Cooling at the heat source with up to 45C inlet water temperature

OS Support: Red Hat, SUSE, Rocky Linux (with LeSI support); Visit lenovopress.com/osig for more information.

Warranty: 3 year CRU & Onsite 9x5 Next Business Day (NBD)